(module MSOP-8 (layer F.Cu) (tedit 56DEE1AE)
  (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference REF** (at 0.7366 -2.4638) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value >NAME (at 0 2.6) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -1.4478 -1.9304) (end -1.524 -2.0066) (layer F.SilkS) (width 0.15))
  (fp_circle (center -0.7112 -1.143) (end -0.8636 -1.2954) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1684 -1.675) (end -1.1684 1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.1684 -1.675) (end 1.1684 1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1684 -1.675) (end 1.1684 -1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1684 1.6764) (end 1.1684 1.675) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/MSOP-8_3x3mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
