(module MSOP-10 (layer F.Cu) (tedit 56DEDCBC)
  (descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference REF** (at 0.7874 -2.3876) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value >NAME (at 0 2.6) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -1.488581 -1.905) (end -1.564781 -1.9558) (layer F.SilkS) (width 0.15))
  (fp_circle (center -0.7112 -1.1938) (end -0.8636 -1.3208) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.1938 1.675) (end 1.1938 -1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1938 1.675) (end -1.1938 -1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1938 -1.675) (end 1.1938 -1.675) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.1938 1.6764) (end 1.1938 1.675) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/MSOP-10_3x3mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
