47 lines
3 KiB
Text
47 lines
3 KiB
Text
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(module SSOP-24 (layer F.Cu) (tedit 56DEDA74)
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(descr "24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.65")
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(attr smd)
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(fp_text reference REF** (at 0 -5.25) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value >NAME (at 0 5.25) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_circle (center -1.636176 -3.6322) (end -1.483776 -3.3274) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.375 4.325) (end -2.375 -4.325) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.375 -4.325) (end 2.375 -4.325) (layer F.SilkS) (width 0.15))
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(fp_line (start -2.375 4.325) (end 2.375 4.325) (layer F.SilkS) (width 0.15))
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(fp_line (start 2.375 4.325) (end 2.375 -4.325) (layer F.SilkS) (width 0.15))
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(fp_circle (center -2.7432 -4.699) (end -2.667 -4.5466) (layer F.SilkS) (width 0.15))
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(pad 1 smd rect (at -3.6 -3.575) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -3.6 -2.925) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -3.6 -2.275) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -3.6 -1.625) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -3.6 -0.975) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -3.6 -0.325) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at -3.6 0.325) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at -3.6 0.975) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at -3.6 1.625) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at -3.6 2.275) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at -3.6 2.925) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at -3.6 3.575) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 3.6 3.575) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 3.6 2.925) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at 3.6 2.275) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at 3.6 1.625) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 3.6 0.975) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 18 smd rect (at 3.6 0.325) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 19 smd rect (at 3.6 -0.325) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 20 smd rect (at 3.6 -0.975) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 21 smd rect (at 3.6 -1.625) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 22 smd rect (at 3.6 -2.275) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 23 smd rect (at 3.6 -2.925) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 24 smd rect (at 3.6 -3.575) (size 1.75 0.45) (layers F.Cu F.Paste F.Mask))
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(model Housings_SSOP.3dshapes/SSOP-24_5.3x8.2mm_Pitch0.65mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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