aaa83ab337
- Added Backlit for DK60TP (need to fix bug for bottom row)
38 lines
2.3 KiB
Text
38 lines
2.3 KiB
Text
(module TSSOP-16 (layer F.Cu) (tedit 56DED843)
|
|
(descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
|
|
(tags "SSOP 0.65")
|
|
(attr smd)
|
|
(fp_text reference REF** (at 0.127 -3.556) (layer F.SilkS)
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
)
|
|
(fp_text value >NAME (at -0.1016 3.683) (layer F.SilkS)
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
)
|
|
(fp_circle (center -2.2225 -3.175) (end -2.3495 -3.302) (layer F.SilkS) (width 0.15))
|
|
(fp_line (start -1.905 -2.794) (end -1.905 2.794) (layer F.SilkS) (width 0.15))
|
|
(fp_line (start 1.905 -2.8) (end 1.905 2.8) (layer F.SilkS) (width 0.15))
|
|
(fp_line (start -1.905 -2.8) (end 1.905 -2.8) (layer F.SilkS) (width 0.15))
|
|
(fp_line (start -1.905 2.8) (end 1.905 2.8) (layer F.SilkS) (width 0.15))
|
|
(fp_circle (center -1.3335 -2.2225) (end -1.4605 -2.3495) (layer F.SilkS) (width 0.15))
|
|
(pad 1 smd rect (at -2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 2 smd rect (at -2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 3 smd rect (at -2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 4 smd rect (at -2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 5 smd rect (at -2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 6 smd rect (at -2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 7 smd rect (at -2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 8 smd rect (at -2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 9 smd rect (at 2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 10 smd rect (at 2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 11 smd rect (at 2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 12 smd rect (at 2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 13 smd rect (at 2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 14 smd rect (at 2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 15 smd rect (at 2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(pad 16 smd rect (at 2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
|
|
(model Housings_SSOP.3dshapes/TSSOP-16_4.4x5mm_Pitch0.65mm.wrl
|
|
(at (xyz 0 0 0))
|
|
(scale (xyz 1 1 1))
|
|
(rotate (xyz 0 0 0))
|
|
)
|
|
)
|