33 lines
1.8 KiB
Plaintext
33 lines
1.8 KiB
Plaintext
(module MSOP-10 (layer F.Cu) (tedit 56DEDCBC)
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(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.5")
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(attr smd)
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(fp_text reference REF** (at 0.7874 -2.3876) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value >NAME (at 0 2.6) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_circle (center -1.488581 -1.905) (end -1.564781 -1.9558) (layer F.SilkS) (width 0.15))
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(fp_circle (center -0.7112 -1.1938) (end -0.8636 -1.3208) (layer F.SilkS) (width 0.15))
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(fp_line (start 1.1938 1.675) (end 1.1938 -1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1938 1.675) (end -1.1938 -1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1938 -1.675) (end 1.1938 -1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1938 1.6764) (end 1.1938 1.675) (layer F.SilkS) (width 0.15))
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(pad 1 smd rect (at -2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at 2.2 1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 2.2 0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 2.2 0) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 2.2 -0.5) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at 2.2 -1) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
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(model Housings_SSOP.3dshapes/MSOP-10_3x3mm_Pitch0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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