31 lines
1.7 KiB
Plaintext
31 lines
1.7 KiB
Plaintext
(module MSOP-8 (layer F.Cu) (tedit 56DEE1AE)
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(descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.65")
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(attr smd)
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(fp_text reference REF** (at 0.7366 -2.4638) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value >NAME (at 0 2.6) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_circle (center -1.4478 -1.9304) (end -1.524 -2.0066) (layer F.SilkS) (width 0.15))
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(fp_circle (center -0.7112 -1.143) (end -0.8636 -1.2954) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1684 -1.675) (end -1.1684 1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start 1.1684 -1.675) (end 1.1684 1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1684 -1.675) (end 1.1684 -1.675) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.1684 1.6764) (end 1.1684 1.675) (layer F.SilkS) (width 0.15))
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(pad 1 smd rect (at -2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at 2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at 2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
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(model Housings_SSOP.3dshapes/MSOP-8_3x3mm_Pitch0.65mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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